Baird Funds, Inc. - Baird Core Plus Bond Fund
549300S4MBFCLLUH2X28
issued
Company data
| Legal name | Baird Funds, Inc. - Baird Core Plus Bond Fund |
| Legal address | c/o ANDREW KETTER, 777 E WISCONSIN AVE, MILWAUKEE, 53202, United States of America |
| Registration authority entity ID | S000000754 |
| Entity status |
Active
|
LEI registration details
| LEI number | 549300S4MBFCLLUH2X28 |
| Status |
Issued
|
| Next renewal date | 2026-01-15 |
| Managing LOU | WM Datenservice |
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Company data
| Legal name | Baird Funds, Inc. - Baird Core Plus Bond Fund |
| Entity status |
Active
|
| Registered at | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Registration authority entity ID | S000000754 |
| Legal jurisdiction | US-WI |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2006-03-01 |
| Validated At | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Validated As | S000000754 |
LEI registration details
| LEI number | 549300S4MBFCLLUH2X28 |
| Status |
Issued
|
| Initial registration | 2018-04-06 |
| Last update | 2025-01-15 |
| Next renewal date | 2026-01-15 |
| Managing LOU | WM Datenservice |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | c/o ANDREW KETTER, 777 E WISCONSIN AVE |
| Postal code | 53202 |
| City | MILWAUKEE |
| Region code | US-WI |
| Country | US | United States of America |
Headquarters address
| Headquarters address | c/o ROBERT W. BAIRD & CO. INCORPORATED, c/o PAUL L SCHULTZ, 777 E WISCONSIN AVE 18TH FL |
| Postal code | 53202-5391 |
| City | Milwaukee |
| Region code | US-WI |
| Country | US | United States of America |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
Baird Core Plus Bond Fund
LEI: 549300S4MBFCLLUH2X28
LEI registration status: ISSUED
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Baird Core Plus Bond Fund
LEI: 549300S4MBFCLLUH2X28
LEI registration status: ISSUED
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