HI-Emerging-Markets-Bonds-IG-FF1-Fonds
copy
5493007KG3TXLGQCM882
5493007KG3TXLGQCM882
issued
Company data
| Legal name | HI-Emerging-Markets-Bonds-IG-FF1-Fonds |
| Legal address | Junghofstraße 24, Frankfurt am Main, 60311, Germany |
| Registration authority entity ID | 70140109 |
| Entity status |
Active
|
LEI registration details
| LEI number | 5493007KG3TXLGQCM882 copy 5493007KG3TXLGQCM882 |
| Status |
Issued
|
| Next renewal date | 2026-07-14 |
| Managing LOU | WM Datenservice |
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Company data
| Legal name | HI-Emerging-Markets-Bonds-IG-FF1-Fonds |
| Entity status |
Active
|
| Registered at | Federal Financial Supervisory Authority (Bundesanstalt für Finanzdienstleistungsaufsicht) Germany, Germany RA000373 |
| Registration authority entity ID | 70140109 |
| Legal jurisdiction | DE |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2009-10-05 |
| Validated At | Federal Financial Supervisory Authority (Bundesanstalt für Finanzdienstleistungsaufsicht) Germany, Germany RA000373 |
| Validated As | 70140109 |
LEI registration details
| LEI number | 5493007KG3TXLGQCM882 copy 5493007KG3TXLGQCM882 |
| Status |
Issued
|
| Initial registration | 2013-03-25 |
| Last update | 2025-05-26 |
| Next renewal date | 2026-07-14 |
| Managing LOU | WM Datenservice |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | Junghofstraße 24 |
| Postal code | 60311 |
| City | Frankfurt am Main |
| Region code | DE-HE |
| Country | DE | Germany |
Headquarters address
| Headquarters address | c/o Helaba Invest Kapitalanlagegesellschaft mbH, Junghofstraße 24 |
| Postal code | 60311 |
| City | Frankfurt am Main |
| Region code | DE-HE |
| Country | DE | Germany |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
HI-Emerging-Markets-Bonds-IG-FF1-Fonds
LEI: 5493007KG3TXLGQCM882
LEI registration status: ISSUED
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HI-Emerging-Markets-Bonds-IG-FF1-Fonds
LEI: 5493007KG3TXLGQCM882
LEI registration status: ISSUED
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